Shielding Unit and Plating Apparatus Including the Same

ABSTRACT

A shielding unit for a plating apparatus may include a shielding plate, a controlling plate and a rotary actuator. The shielding plate may have a plurality of holes configured to permit a passage of an electrolyte therethrough. The controlling plate may make contact with the shielding plate. The controlling plate may have a plurality of controlling holes for controlling an opening ratio of the plurality of holes of the shielding plate. The rotary actuator may rotate the controlling plate to control the opening ratio of the plurality of holes shielding plate.

CROSS-RELATED APPLICATION

This application claims priority under 35 USC §119 to Korean PatentApplication No. 10-2015-0115155, filed on Aug. 17, 2015, the contents ofwhich are hereby incorporated by reference in their entirety.

BACKGROUND

1. Field

Example embodiments relate to a shielding unit and a plating apparatusincluding the same. More particularly, example embodiments relate to ashielding unit configured to selectively shield an electrolyte, and aplating apparatus including the shielding unit.

2. Description of the Related Art

Generally, a plating apparatus may include a plating bath, an anode anda cathode. The plating bath may be configured to receive an electrolyte.The anode and the cathode may be arranged in the plating bath. Thecathode may be arranged facing the anode. The cathode may be configuredto hold an object. A current may be supplied from the anode to thecathode through the electrolyte to plate a metal layer on the object.

According to related arts, the current may flow through the electrolyte.Thus, a distribution of the electrolyte may determine a thicknessuniformity of the plated layer. In order to uniformly distribute theelectrolyte, a shielding plate may be arranged between the anode and thecathode. The shielding plate may have a plurality of holes through whichthe electrolyte may pass.

However, the holes of the shielding plate may not uniformly distributethe electrolyte. Further, it may be required to exchange the shieldingplate for another shielding plate when a different object is beingplated.

SUMMARY

Example embodiments provide a shielding unit for a plating apparatusthat may be capable of uniformly distribute an electrolyte withoutchange of a shielding plate in accordance with kinds of objects.

Example embodiments also provide a plating apparatus including theabove-mentioned shielding unit.

According to example embodiments, there may be provided a shielding unitfor a plating apparatus. The shielding unit for the plating apparatusmay include a shielding plate, a controlling plate and a rotaryactuator. The shielding plate may have a plurality of holes configuredto permit a passage of an electrolyte therethrough. The controllingplate may make contact with the shielding plate. The controlling platemay have a plurality of controlling holes for controlling an openingratio of the plurality of holes of the shielding plate. The rotaryactuator may rotate the controlling plate to control the opening ratioof the plurality of holes shielding plate.

In example embodiments, each of the plurality of holes of the shieldingplate may have a size substantially the same as a size of each of theplurality of controlling holes.

In example embodiments, the plurality of holes of the shielding platemay be arranged spaced apart from each other by substantially the sameinterval. The plurality of controlling holes may be arranged spacedapart from each other by an interval substantially the same as theinterval between the plurality of holes of the shielding plate.

In example embodiments, the shielding plate may have a circular shape.The controlling plate may have a rectangular shape.

In example embodiments, the rotary actuator may rotate the controllingplate with respect to a center point of the controlling plate.

In example embodiments, the shielding plate is a first shielding plateand the plurality of holes are a plurality of first holes, and theshielding unit may further include a second shielding plate configuredto make contact with the controlling plate. The second shielding platemay have a plurality of second holes configured to permit a passage ofan electrolyte therethrough.

In example embodiments, each of the plurality of second holes may have asize substantially the same as the size of each of the plurality offirst holes. The plurality of first holes may be arranged spaced apartfrom each other by substantially the same interval. The plurality ofsecond holes may be arranged spaced apart from each other by an intervalsubstantially the same as the interval between the plurality of firstholes.

According to example embodiments, there may be provided a shielding unitfor a plating apparatus. The shielding unit for the plating apparatusmay include a shielding plate, a first controlling plate and a secondcontrolling plate. The shielding plate may have a plurality of holesconfigured to permit a passage of an electrolyte therethrough. The firstcontrolling plate may make contact with a first region of the shieldingplate. The first controlling plate may have a plurality of firstcontrolling holes for controlling an opening ratio of the plurality ofholes in the first region of the shielding plate. The second controllingplate may make contact with a second region of the first shieldingplate. The second controlling plate may have a plurality of secondcontrolling holes for controlling an opening ratio of the plurality ofholes in the second region of the shielding plate.

In example embodiments, the first region may include an at least centralregion of the shielding plate. The second region may include an edgeregion of the shielding plate. The first controlling plate may include asingle plate configured to make contact with the central region of theshielding plate. The second controlling plate may include a pair ofplates arranged at opposing sides of the first controlling plate andconfigured to make contact with the edge region of the shielding plate.

In example embodiments, the shielding unit may further include a thirdcontrolling plate arranged between the first controlling plate and thesecond controlling plates. The third controlling plate may be configuredto make contact with a third region of the shielding plate. The thirdcontrolling plate may have a plurality of third controlling holesconfigured to control an opening ratio of the plurality of holes in thethird region of the shielding plate.

In example embodiments, the first region and the second region may bedefined by a radius line of the shielding plate.

In example embodiments, the plurality of holes of the shielding plate,the first controlling holes and the second controlling holes may have asubstantially same size.

In example embodiments, the shielding unit may further include a linearactuator configured to move the first controlling plate and the secondcontrolling plate linearly and individually for controlling the openingratio of the plurality of holes of the shielding plate.

In example embodiments, the shielding unit may further include a secondshielding plate configured to make contact with the first controllingplate and the second controlling plate. The second shielding plate mayhave a plurality of second holes through which the electrolyte may pass.

According to example embodiments, there may be provided a platingapparatus. The plating apparatus may include a plating bath, an anode, acathode and a shielding unit. The plating bath may be configured toreceive an electrolyte. The anode may be arranged in the plating bath.The cathode may be arranged in the plating bath. The cathode may bearranged facing the anode. The cathode may be configured to hold anobject. The shielding unit may include a shielding plate, a controllingplate and a rotary actuator. The shielding plate may be arranged betweenthe anode and the cathode. The shielding plate may have a plurality ofshielding holes through which the electrolyte may pass. The controllingplate may make contact with the shielding plate. The controlling platemay have a plurality of controlling holes for controlling an openingratio of the plurality of shielding holes. The rotary actuator mayrotate the controlling plate to control the opening ratio of theplurality of shielding holes.

According to example embodiments, there may be provided a platingapparatus. The plating apparatus may include a plating bath, an anode, acathode and a shielding unit. The plating bath may be configured toreceive an electrolyte. The anode may be arranged in the plating bath.The cathode may be arranged in the plating bath. The cathode may bearranged facing the anode. The cathode may be configured to hold anobject. The shielding unit may include a shielding plate, a firstcontrolling plate and a second controlling plate. The shielding platemay be arranged between the anode and the cathode. The shielding platemay have a plurality of holes through which an electrolyte may pass. Thefirst controlling plate may make contact with a first region of theshielding plate. The first controlling plate may have a plurality offirst controlling holes for controlling an opening ratio of theplurality of holes in the first region of the shielding plate. Thesecond controlling plate may make contact with a second region of thefirst shielding plate. The second controlling plate may have a pluralityof second controlling holes for controlling opening ratio of theplurality of holes in the second region of the shielding plate.

According to example embodiments, a shielding unit for a platingapparatus includes a shielding plate having a plurality of holesconfigured to permit a passage of an electrolyte therethrough; acontrolling plate positioned adjacent the shielding plate, thecontrolling plate having a plurality of controlling holes configured tocontrol an opening ratio of the plurality of holes of the shieldingplate; and an actuator configured to move the controlling plate tocontrol the opening ratio of the plurality of holes of the shieldingplate.

In example embodiments, the shielding unit is configured to bepositioned in a plating apparatus comprising a plating bath, an anode, acathode, and a diffusion plate between the anode and the cathode, theshielding unit being configured to be positioned between the diffusionplate and the cathode.

In example embodiments, the actuator is configured to move thecontrolling plate from a first position to a second position thatchanges a degree to which the plurality of controlling holes overlap theplurality of holes of the shielding plate to thereby control the openingratio of the plurality of holes of the shielding plate.

In example embodiments, the shielding plate includes a first shieldingplate and the plurality of holes comprises a plurality of first holes,the shielding unit further comprising a second shielding plateconfigured to make contact with the controlling plate, the secondshielding plate having a plurality of second holes configured to permita passage of an electrolyte therethrough.

In example embodiments, each of the plurality of second holes has a sizesubstantially the same as a size of each of the plurality of firstholes, the plurality of first holes are arranged spaced apart from eachother by a substantially same interval, and the plurality of secondholes are arranged spaced apart from each other by an intervalsubstantially the same as the interval between the plurality of firstholes.

According to example embodiments, the controlling holes of thecontrolling plate may be selectively and partially overlapped with theplurality of holes of the shielding plate to control the opening ratioof the plurality of holes. Thus, the electrolyte may be uniformlydistributed to improve a thickness uniformity of a plated layer.Particularly, the opening ratio of the plurality of holes may becontrolled by changing a position of the controlling plate in accordancewith the type of object being plated so that it may not be required toexchange the shielding plate for another shielding plate when the objectbeing plated is changed.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings. FIGS. 1 to 14 represent non-limiting, example embodiments asdescribed herein.

FIG. 1 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments;

FIG. 2 is a perspective view illustrating the shielding unit in FIG. 1;

FIG. 3 is a front view illustrating the shielding unit in FIG. 2;

FIG. 4 is a cross-sectional view taken along a line IV-IV′ in FIG. 3;

FIG. 5 is a front view illustrating a rotated controlling plate of theshielding unit in FIG. 2;

FIG. 6 is a cross-sectional view taken along a line VI-VI′ in FIG. 5;

FIG. 7 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments;

FIG. 8 is a front view illustrating the shielding unit in FIG. 7;

FIG. 9 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments;

FIG. 10 is a front view illustrating the shielding unit in FIG. 9;

FIG. 11 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments;

FIG. 12 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments;

FIG. 13 is a front view illustrating the shielding unit in FIG. 12; and

FIG. 14 is a cross-sectional view illustrating a plating apparatusincluding the shielding unit in FIG. 1.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Various example embodiments will be described more fully hereinafterwith reference to the accompanying drawings, in which some exampleembodiments are shown. The present invention may, however, be embodiedin many different forms and should not be construed as limited to theexample embodiments set forth herein. Rather, these example embodimentsare provided so that this disclosure will be thorough and complete, andwill fully convey the scope of the present invention to those skilled inthe art. In the drawings, the sizes and relative sizes of layers andregions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layeror intervening elements or layers may be present. In contrast, when anelement is referred to as being “directly on,” “directly connected to”or “directly coupled to” another element or layer, there are nointervening elements or layers present. Like numerals refer to likeelements throughout. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularexample embodiments only and is not intended to be limiting of thepresent invention. As used herein, the singular forms “a,” “an” and“the” are intended to include the plural forms as well, unless thecontext clearly indicates otherwise. It will be further understood thatthe terms “comprises” and/or “comprising,” when used in thisspecification, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Example embodiments are described herein with reference tocross-sectional illustrations that are schematic illustrations ofidealized example embodiments (and intermediate structures). As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, example embodiments should not be construed as limitedto the particular shapes of regions illustrated herein but are toinclude deviations in shapes that result, for example, frommanufacturing. Thus, the regions illustrated in the figures areschematic in nature and their shapes are not intended to illustrate theactual shape of a region of a device and are not intended to limit thescope of the present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

Hereinafter, example embodiments will be explained in detail withreference to the accompanying drawings.

Shielding Unit for a Plating Apparatus

FIG. 1 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments, FIG. 2 is a perspective viewillustrating the shielding unit in FIG. 1, FIG. 3 is a front viewillustrating the shielding unit in FIG. 2, and FIG. 4 is across-sectional view taken along a line IV-IV′ in FIG. 3.

Referring to FIGS. 1 to 4, a shielding unit 100 of this exampleembodiment may include a first shielding plate 110, a second shieldingplate 120, a controlling plate 130 and a rotary actuator 140. The firstshielding plate 110 and the second shielding plate 120 may be arrangedto face each other. The controlling plate 130 may be arranged betweenthe first shielding plate 110 and the second shielding plate 120.

The first shielding plate 110 may be oriented toward an anode of aplating apparatus. The first shielding plate 110 may be fixed to aplating bath of the plating apparatus. The first shielding plate 110 mayhave a plurality of first holes 112. An electrolyte may pass through thefirst holes 112. The first holes 112 may be arranged spaced apart fromeach other in lengthwise and breadthwise directions by substantially thesame interval. Alternatively, the first holes 112 may be arranged spacedapart from each other in lengthwise and breadthwise directions by adifferent interval. The first shielding plate 110 may have a circularshape. Alternatively, the first shielding plate 110 may have anysuitable shape including the circular shape.

The second shielding plate 120 may be oriented toward a cathode of theplating apparatus. The cathode may be configured to hold an object onwhich a plated layer may be formed. The second shielding plate 120 mayhave a shape substantially the same as the shape of the first shieldingplate 110. Thus, the second shielding plate 120 may have the circularshape including a plurality of second holes 122. The second holes 122may be arranged spaced apart from each other in the lengthwise andbreadthwise directions by an interval substantially the same as theinterval between the first holes 112. Each of the second holes 122 mayhave a size substantially the same as that of each of the first holes112. Further, numbers of the second holes 122 may be substantially thesame as numbers of the first holes 112. Alternatively, the secondshielding plate 122 may have any suitable shape including the circularshape. In some embodiments, the shielding unit 100 may not include thesecond shielding plate 120. That is, the shielding unit 100 may includeonly the first shielding plate 110, the controlling plate 130 and therotary actuator 140.

The controlling plate 130 may be interposed between the first shieldingplate 110 and the second shielding plate 120. The controlling plate 130,the first shielding plate 110 and the second shielding plate 120 mayhave a same axis. The controlling plate 130 may be rotatably arranged inthe plating bath. The controlling plate 130 may be rotated with respectto a center point of the controlling plate 130.

The controlling plate 130 may have a rectangular shape; however, anysuitable shape may be used. In example embodiments, the controllingplate 130 may have a square shape. The controlling plate 130 may have afirst surface oriented toward the first shielding plate 110, and asecond surface oriented toward the second shielding plate 120. Thesecond surface may be opposite to the first surface. The first surfaceof the controlling plate 130 may make contact with the first shieldingplate 110. The second surface of the controlling plate 130 may makecontact with the second shielding plate 120.

The controlling plate 130 may have a plurality of controlling holes 132.The controlling holes 132 may be arranged spaced apart from each otherin the lengthwise and breadthwise directions by an intervalsubstantially the same as the interval between the first holes 112. Eachof the controlling holes 132 may have a size substantially the same asthe size of each of the first holes 112. Thus, the controlling holes 132may be fully or partially overlapped with the first holes 112 inaccordance with rotation angles of the controlling plate 130. When thecontrolling holes 132 may be fully overlapped and align with the firstholes 112, the size of each of the first holes 112 may be maintained. Incontrast, when the controlling holes 132 may be partially overlappedwith the first holes 112, the first holes 112 may be partially blockedby the controlling plate 132 so that the size of the first hole 112partially overlapped with the controlling hole 132 may be decreased. Thesize of the first holes 112 may be controlled by changing positions ofthe controlling holes 132 so that an amount of a current through thefirst holes 112 may be controlled. Therefore, a thickness of the platedlayer may be controlled depending on a position of the object to improvea thickness uniformity of the plated layer.

The rotary actuator 140 may be configured to rotate the controllingplate 130 to control the overlapped ratios between the controlling holes132 and the first holes 112, which are referred to herein as an “openingratio.” The rotary actuator 140 may rotate the controlling plate 130with respect to the center point of the controlling plate 130. When theobject to be plated may be identified, the rotary actuator 140 mayrotate the controlling plate 130 to provide the first holes 112 withopening ratios. In order to prevent the opening ratios from beingchanged during a plating process, the rotary actuator 140 may not rotatethe controlling plate 130. Thus, the controlling plate 130 may be fixedduring the plating process.

Because the rotary actuator 140 may rotate the controlling plate 130with respect to the center point of the controlling plate 130, an edgedcontrolling hole 132 far from the center point of the controlling plate132 may have a travel length relatively longer than a travel length of acentral controlling hole 132 adjacent to the center point of thecontrolling plate 132.

Therefore, when the rotary actuator 140 may rotate the controlling plate132 under a condition that the controlling holes 132 may be fullyoverlapped with the first holes 112, a central opening ratio of thefirst hole 112, which may correspond to an overlapped ratio between thecentral first hole 112 adjacent to the center point of the firstshielding plate 110 and the central controlling hole 132 adjacent to thecenter point of the controlling plate 130, may be higher than aperipheral opening ratio of the first hole 112, which may correspond toan overlapped ratio between the edged first hole 112 far from the centerpoint of the first shielding plate 110 and the edged controlling hole132 far from the center point of the controlling plate 132. Thus, anamount of the electrolyte passing through the central first hole 112 maybe relatively larger than an amount of the electrolyte passing throughthe edged first hole 112 so that the plated layer on an central regionof the object may have a thickness greater than a thickness of theplated layer on an edge region of the object. Controlling the openingratios of the first holes 112 with respect to the central region and theedge region of the object may be determined by an introducing directionof the electrolyte. Because the electrolyte may be supplied from theedge region of the object to the central region of the object, anelectrolyte may be more concentrated on the edge region of the objectrather than the central region of the object. Thus, the thickness of theplated layer on the edge region of the object may be thicker than thethickness of the plated layer on the central region of the object. Inorder to provide the plated layer with the uniform thickness, theelectrolyte may be uniformly distributed by controlling the openingratios of the first holes 112.

Referring to FIGS. 3 and 4, the first holes 112 of the first shieldingplate 110 may be fully overlapped with the controlling holes 132 of thecontrolling plate 130. Thus, the opening ratios of the first holes 112may be about 100%. The electrolyte may be supplied to the entire regionsof the object through the first holes 112, the controlling holes 132 andthe second holes 122. However, as mentioned above, because theelectrolyte may be supplied from the edge region of the object to thecentral region of the object, the amount of the electrolyte supplied tothe edge region of the object may be larger than the amount of theelectrolyte supplied to the central region of the object so that thethickness of the plated layer on the edge region of the object may bethicker than the thickness of the plated layer on the central region ofthe object.

FIG. 5 is a front view illustrating a rotated controlling plate of theshielding unit in FIG. 2, and FIG. 6 is a cross-sectional view takenalong a line VI-VI′ in FIG. 5.

Referring to FIGS. 5 and 6, the rotary actuator 140 may rotate thecontrolling plate 130 with respect to the center point of thecontrolling plate 130. As mentioned above, because the travel length ofthe edged controlling hole 132 far from the center point of thecontrolling plate 132 may be relatively longer than the travel length ofthe central controlling hole 132 adjacent to the center point of thecontrolling plate 132, the central opening ratio of the first hole 112may be higher than the peripheral opening ratio of the first hole 112.Thus, an amount of the electrolyte passing through the central firsthole 112 may be larger than an amount of the electrolyte passing throughthe edged first hole 112. As a result, the plated layer on the objectmay have uniform thickness.

According to this example embodiment, the opening ratios of the firstholes in the first shielding plate may be selectively controlled byrotating the controlling plate. Therefore, the plated layer may have theuniform thickness.

FIG. 7 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments, and FIG. 8 is a front viewillustrating the shielding unit in FIG. 7.

Referring to FIGS. 7 and 8, a shielding unit 100 a of this exampleembodiment may include a first shielding plate 110, a second shieldingplate 120, a first controlling plate 150, a second controlling plate160, a first linear actuator 142 and a second linear actuator 144.

In example embodiments, the first shielding plate 110 and the secondshielding plate 120 may have substantially the same structures as thoseof the first shielding plate 110 and the second shielding plate 120 inFIG. 1, respectively. Thus, the same reference numerals may refer to thesame elements and any further illustrations with respect to the firstshielding plate 110 and the second shielding plate 120 may be omittedherein for brevity.

The first controlling plate 150 may be configured to make contact with afirst region of the first shielding plate 110. The second controllingplate 160 may be configured to make contact with a second region of thefirst shielding plate 110. The first region may correspond to a centralregion of the first shielding plate 110. The second region maycorrespond to an edge region of the first shielding plate 110.

The first controlling plate 150 may be a single plate having arectangular shape. The second controlling plate 160 may be a pair ofplates arranged at both sides of the first controlling plate 160. Thus,a combined structure of the first controlling plate 150 and the twosecond controlling plates 160 may have a shape substantially the same asthe shape of the controlling plate 130 in FIG. 1. That is, the firstcontrolling plate 150 and the two second controlling plates 160 may beformed by dividing the controlling plate 130 in FIG. 1 into threeplates.

The first controlling plate 150 may be configured to make contact withthe central region, an upper edge region and a lower edge region of thefirst shielding plate 110. Thus, the first region may include at leastthe central region of the first shielding plate 110. The pair of thesecond controlling plates 160 may be configured to make contact with aleft edge region and a right edge region of the first shielding plate110. Thus, the second region may partially include the edge region ofthe first shielding plate 110. Alternatively, the first region and thesecond region of the first shielding plate 110 may not be restrictedwithin the above-mentioned regions. The first region and the secondregion of the first shielding plate 110 may be changed in accordancewith a type of object being plated.

The first controlling plate 150 may have a plurality of firstcontrolling holes 152. The second controlling plate 160 may have aplurality of second controlling holes 162. The first controlling holes152 and the second controlling holes 162 may be arranged spaced apartfrom each other in the lengthwise and breadthwise directions bysubstantially the same interval. Alternatively, the first controllingholes 152 and the second controlling holes 162 may be arranged spacedapart from each other in the lengthwise and breadthwise directions by adifferent interval.

The first linear actuator 142 may be configured to linearly move thefirst controlling plate 150. Thus, overlapped ratios between the firstcontrolling holes 152 of the first controlling plate 150 and the centralfirst holes 112 of the first shielding plate 110 may be adjusted tocontrol the central opening ratio of the central first holes 112 in thefirst shielding plate 110. The first linear actuator 142 may linearlymove the first controlling plate 150 to provide the central first holes112 of the first shielding plate 110 with the central opening ratio. Inorder to prevent the central opening ratio from being changed during theplating process, the first linear actuator 142 may not linearly move thefirst controlling plate 150. Thus, the first controlling plate 150 maybe fixed during the plating process.

The second linear actuator 144 may be configured to linearly move thesecond controlling plate 160. Thus, overlapped ratios between the secondcontrolling holes 162 of the second controlling plate 160 and the edgedfirst holes 112 of the first shielding plate 110 may be adjusted tocontrol the peripheral opening ratio of the edged first holes 112 in thefirst shielding plate 110. The second linear actuator 144 may linearlymove the second controlling plate 160 to provide the edged first holes112 of the first shielding plate 110 with the peripheral opening ratio.In order to prevent the peripheral opening ratio from being changedduring the plating process, the second linear actuator 144 may notlinearly move the second controlling plate 160. Thus, the secondcontrolling plate 160 may be fixed during the plating process.

Alternatively, the first controlling plate 150 may be fixed. That is,the first linear actuator 142 may not be connected with the firstcontrolling plate 150. Further, the second controlling plate 160 may befixed. That is, the second linear actuator 144 may not be connected withthe second controlling plate 160.

According to this example embodiment, the opening ratios of the firstholes in the first shielding plate may be regionally controlled bylinearly moving the controlling plates. Therefore, the thickness of theplated layer may be accurately controlled in accordance with a type ofobject being plated.

FIG. 9 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments, and FIG. 10 is a front viewillustrating the shielding unit in FIG. 9.

Referring to FIGS. 9 and 10, a shielding unit 100 b of this exampleembodiment may include a first shielding plate 110, a second shieldingplate 120, a first controlling plate 170, a second controlling plate180, a third controlling plate 190, a first linear actuator 146, asecond linear actuator 147 and a third linear actuator 148.

In example embodiments, the first shielding plate 110 and the secondshielding plate 120 may have substantially the same structures as thoseof the first shielding plate 110 and the second shielding plate 120 inFIG. 1, respectively. Thus, the same reference numerals may refer to thesame elements and any further illustrations with respect to the firstshielding plate 110 and the second shielding plate 120 may be omittedherein for brevity.

The first controlling plate 170 may be configured to make contact with afirst region of the first shielding plate 110. The second controllingplate 180 may be configured to make contact with a second region of thefirst shielding plate 110. The third controlling plate 190 may beconfigured to make contact with a third region of the first shieldingplate 110. The first region may correspond to a central region of thefirst shielding plate 110. The second region may correspond to an edgeregion of the first shielding plate 110. The third region may correspondto a middle region between the central region and the edge region of thefirst shielding plate 110.

The first controlling plate 170 may be a single plate having arectangular shape. The second controlling plate 180 may be a pair ofplates arranged at both sides of the first controlling plate 160. Thethird controlling plate 190 may be a pair of plates arranged between thefirst controlling plate 170 and the second controlling plates 180. Thus,a combined structure of the first controlling plate 170, the two secondcontrolling plates 180 and the two third controlling plates 190 may havea shape substantially the same as the shape of the controlling plate 130in FIG. 1. That is, the first controlling plate 170, the two secondcontrolling plates 180 and the two third controlling plates 190 may beformed by dividing the controlling plate 130 in FIG. 1 into five plates.

The first controlling plate 170 may be configured to make contact withthe central region, an upper edge region and a lower edge region of thefirst shielding plate 110. Thus, the first region may include at leastthe central region of the first shielding plate 110. The pair of thesecond controlling plates 180 may be configured to make contact with aleft edge region and a right edge region of the first shielding plate110. Thus, the second region may partially include the edge region ofthe first shielding plate 110. The pair of the third controlling plates190 may be configured to make contact with the middle region between thecentral region and the right and left edge regions of the firstshielding plate 110. Alternatively, the first region, the second regionand the third region of the first shielding plate 110 may not berestricted within the above-mentioned regions. The first region, thesecond region and the third region of the first shielding plate 110 maybe changed in accordance with a type of object being plated.

The first controlling plate 170 may have a plurality of firstcontrolling holes 172. The second controlling plate 180 may have aplurality of second controlling holes 182. The third controlling plate190 may have a plurality of third controlling holes 192. The firstcontrolling holes 172, the second controlling holes 182 and the thirdcontrolling holes 192 may be arranged spaced apart from each other inthe lengthwise and breadthwise directions by substantially the sameinterval. Alternatively, the first controlling holes 172, the secondcontrolling holes 182 and the third controlling holes 192 may bearranged spaced apart from each other in the lengthwise and breadthwisedirections by a different interval.

The first linear actuator 146 may be configured to linearly move thefirst controlling plate 170. Thus, overlapped ratios between the firstcontrolling holes 172 of the first controlling plate 170 and the centralfirst holes 112 of the first shielding plate 110 may be adjusted tocontrol the central opening ratio of the central first holes 112 in thefirst shielding plate 110. The first linear actuator 146 may linearlymove the first controlling plate 170 to provide the central first holes112 of the first shielding plate 110 with the central opening ratio. Inorder to prevent the central opening ratio from being changed during theplating process, the first linear actuator 146 may not linearly move thefirst controlling plate 170. Thus, the first controlling plate 170 maybe fixed during the plating process.

The second linear actuator 147 may be configured to linearly move thesecond controlling plate 180. Thus, overlapped ratios between the secondcontrolling holes 182 of the second controlling plate 180 and the edgedfirst holes 112 of the first shielding plate 110 may be adjusted tocontrol the peripheral opening ratio of the edged first holes 112 in thefirst shielding plate 110. The second linear actuator 147 may linearlymove the second controlling plate 180 to provide the edged first holes112 of the first shielding plate 110 with the peripheral opening ratio.In order to prevent the peripheral opening ratio from being changedduring the plating process, the second linear actuator 147 may notlinearly move the second controlling plate 180. Thus, the secondcontrolling plate 180 may be fixed during the plating process.

The third linear actuator 148 may be configured to linearly move thethird controlling plate 190. Thus, overlapped ratios between the thirdcontrolling holes 192 of the third controlling plate 190 and the middlefirst holes 112 of the first shielding plate 110 may be adjusted tocontrol the middle opening ratio of the middle first holes 112 in thefirst shielding plate 110. The third linear actuator 148 may linearlymove the third controlling plate 190 to provide the edged first holes112 of the first shielding plate 110 with the middle opening ratio. Inorder to prevent the middle opening ratio from being changed during theplating process, the third linear actuator 148 may not linearly move thethird controlling plate 190. Thus, the third controlling plate 190 maybe fixed during the plating process.

Alternatively, the first controlling plate 170 may be fixed. That is,the first linear actuator 146 may not be connected with the firstcontrolling plate 170. The second controlling plate 180 may be fixed.That is, the second linear actuator 147 may not be connected with thesecond controlling plate 180. The third controlling plate 190 may befixed. That is, the third linear actuator 148 may not be connected withthe third controlling plate 190. Further, at least one of the first tothird controlling plates 170, 180 and 190 may be rotatably arranged. Atleast one of the first to third controlling plates 170, 180 and 190 maybe fixed.

In example embodiments, the controlling plate may be divided into thethree plates or the five plates. However, the number of plates that theshielding plate may be divided into is not restricted to a specificnumber, and any suitable number of plates and/or configuration of platesmay be used. The number of plates that the shielding plate may bedivided into may be changed in accordance with the kinds of the objectsbeing plated.

FIG. 11 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments.

A shielding unit 100 c of this example embodiment may include elementssubstantially the same as those of the shielding unit 100 a in FIG. 7except for a first shielding plate and a second shielding plate. Thus,the same reference numerals may refer to the same elements and anyfurther illustrations with respect to the same elements may be omittedherein for brevity.

Referring to FIG. 11, a first shielding plate may be divided into asingle first central shielding plate 110-1 and two first side shieldingplates 110-2 by two parallel vertical lines.

The first central shielding plate 110-1 may correspond to a position ofthe first controlling plate 150. Thus, the first central shielding plate110-1 may have a width substantially the same as that of the firstcontrolling plate 150. Alternatively, the first central shielding plate110-1 may have a width different from that of the first controllingplate 150.

The first side shielding plates 110-2 may correspond to the position ofthe second controlling plates 160. Thus, the first side shielding plate110-2 may have a width substantially the same as that of the secondcontrolling plates 160. Alternatively, the first side shielding plate110-2 may have a width different from that of the second controllingplates 160.

Linear actuators 143 may be configured to linearly move the firstcentral shielding plate 110-1 and the first side shielding plate 110-2.Alternatively, the first central shielding plate 110-1 may be fixed.That is, the linear actuator 143 may not be connected with the firstcentral shielding plate 110-1. Further, the first side shielding plates110-2 may be fixed. That is, the linear actuators 143 may not beconnected with the first side shielding plates 110-2.

A second shielding plate may be divided into a single second centralshielding plate 120-1 and two second side shielding plates 120-2 by twoparallel vertical lines. The second central shielding plate 120-1 mayhave a size substantially the same as that of the first centralshielding plate 110-1. The second side shielding plates 120-2 may have asize substantially the same as that of the first side shielding plates110-2.

Linear actuators 145 may be configured to linearly move the secondcentral shielding plate 120-1 and the second side shielding plate 120-2.Alternatively, the second central shielding plate 120-1 may be fixed.That is, the linear actuator 145 may not be connected with the secondcentral shielding plate 120-1. Further, the second side shielding plates120-2 may be fixed. That is, the linear actuators 145 may not beconnected with the second side shielding plates 120-2.

In example embodiments, the shielding plate may be divided into thethree plates. However, the number of plates that the shielding plate maybe divided into is not restricted to a specific number, and any suitablenumber of plates and/or configuration of plates may be used. The numberof plates that the shielding plate may be divided into may be changed inaccordance with the kinds of the objects being plated.

FIG. 12 is an exploded perspective view illustrating a shielding unit inaccordance with example embodiments, and FIG. 13 is a front viewillustrating the shielding unit in FIG. 12.

Referring to FIGS. 12 and 13, a shielding unit 200 of this exampleembodiment may include a first shielding plate 110, a second shieldingplate 120, a first controlling plate 210, a second controlling plate220, a third controlling plate 230, a fourth controlling plate 240, afirst linear actuator 250, a second linear actuator 252, a third linearactuator 254 and a fourth linear actuator 256.

In example embodiments, the first shielding plate 110 and the secondshielding plate 120 may have substantially the same structures as thoseof the first shielding plate 110 and the second shielding plate 120 inFIG. 1, respectively. Thus, the same reference numerals may refer to thesame elements and any further illustrations with respect to the firstshielding plate 110 and the second shielding plate 120 may be omittedherein for brevity.

The first shielding plate 110 may be divided into a plurality of regionsby a radius line of the first shielding plate 110. In exampleembodiments, the first shielding plate 110 may be divided into first tofourth regions by two diameter lines substantially perpendicular to eachother. The first to fourth regions may have a same quarter shape.

The first controlling plate 210 may be configured to make contact with afirst region of the first shielding plate 110. The second controllingplate 220 may be configured to make contact with a second region of thefirst shielding plate 110. The third controlling plate 230 may beconfigured to make contact with a third region of the first shieldingplate 110. The fourth controlling plate 240 may be configured to makecontact with a fourth region of the first shielding plate 110. Asmentioned above, because the first to fourth regions may have the samesize and shape, the first to fourth controlling plates 210, 220, 230 and240 may have a same square shape. That is, the first to fourthcontrolling plates 210, 220, 230 and 240 may be formed by dividing thecontrolling plate 130 in FIG. 2 along the two diameter lines.

The first region may correspond to a central region of the firstshielding plate 110. The second region may correspond to an edge regionof the first shielding plate 110. The third region may correspond to amiddle region between the central region and the edge region of thefirst shielding plate 110.

The first controlling plate 210 may have a plurality of firstcontrolling holes 212. The second controlling plate 220 may have aplurality of second controlling holes 222. The third controlling plate230 may have a plurality of third controlling holes 232. The fourthcontrolling plate 240 may have a plurality of fourth controlling holes242. The first controlling holes 212, the second controlling holes 222,the third controlling holes 232 and the fourth controlling holes 242 maybe arranged spaced apart from each other in the lengthwise andbreadthwise directions by substantially the same interval.Alternatively, the first controlling holes 212, the second controllingholes 222, the third controlling holes 232 and the fourth controllingholes 242 may be arranged spaced apart from each other in the lengthwiseand breadthwise directions by a different interval.

The first linear actuator 250 may be configured to linearly move thefirst controlling plate 210. The second linear actuator 252 may beconfigured to linearly move the second controlling plate 220. The thirdlinear actuator 254 may be configured to linearly move the thirdcontrolling plate 230. The fourth linear actuator 256 may be configuredto linearly move the fourth controlling plate 240. The linear directionsmay not be restricted to a specific direction. For example, the lineardirections may include a radius direction of the first shielding plate110, a direction substantially parallel to the diameter line of thefirst shielding plate 110, etc. During the plating process, the first tofourth linear actuators 250, 252, 254 and 256 may not linearly move thefirst to fourth controlling plates 210, 220, 230 and 240. Thus, thefirst to fourth controlling plates 210, 220, 230 and 240 may be fixed inthe plating process.

Alternatively, the first controlling plate 210 may be fixed. That is,the first linear actuator 250 may not be connected with the firstcontrolling plate 210. The second controlling plate 220 may be fixed.That is, the second linear actuator 252 may not be connected with thesecond controlling plate 220. The third controlling plate 230 may befixed. That is, the third linear actuator 254 may not be connected withthe third controlling plate 230. The fourth controlling plate 240 may befixed. That is, the fourth linear actuator 256 may not be connected withthe fourth controlling plate 240. Further, at least one of the first tofourth controlling plates 210, 22, 230 and 240 may be rotatablyarranged. At least one of the first to fourth controlling plates 210,220, 230 and 240 may be fixed.

In example embodiments, the controlling plate may be divided into thefour plates by the four radius lines. However, the number of plates thatthe shielding plate may be divided into is not restricted to a specificnumber, and any suitable number of plates and/or configuration of platesmay be used. The number of plates that the shielding plate may bedivided into may be changed in accordance with the kinds of the objectsbeing plated.

Plating Apparatus

FIG. 14 is a cross-sectional view illustrating a plating apparatusincluding the shielding unit in FIG. 1.

Referring to FIG. 14, a plating apparatus 300 of this example embodimentmay include a plating bath 310, an anode chamber 320, a cathode chamber330, a diffusion plate 340 and a shielding unit 100.

The plating bath 310 may be configured to receive an electrolyte. Theplating bath 310 may include an inlet 312 through which the electrolytemay be introduced, and an outlet 314 through which the electrolyte maybe discharged. The inlet 312 may be formed at a lower surface of theplating bath 310. The outlet 314 may be formed at an upper surface ofthe plating bath 310. A pump 360 may be connected with the inlet 312 andthe outlet 314. The pump 360 may supply the electrolyte to the platingbath 310.

The anode chamber 320 may be arranged under the plating bath 310. Ananode 322 may be arranged in the anode chamber 320. The cathode chamber330 may be arranged over the plating bath 310. A cathode 332 may bearranged in the cathode chamber 330. The cathode 332 may be rotated by arotating shaft. A clamshell 336 for generating en electric field may bearranged on an inner surface of the cathode chamber 330.

The anode 322 and the cathode 332 may be connected to a power source350. The cathode 332 may be configured to hold an object. In exampleembodiments, the object may include a wafer. The plating apparatus 300may form a metal layer on the wafer for forming a wafer level package.The metal layer may include a nickel layer, a copper layer, a goldlayer, etc. Alternatively, the object may not be restricted to a wafer.For example, the plating apparatus 300 may be used for a damasceneprocess, a process for forming a bump, a process for forming aredistribution layer, etc.

The diffusion plate 340 may be arranged between the anode 322 and thecathode 332 to uniformly diffuse the electrolyte. A filter 370 may bearranged between the diffusion plate 340 and the anode 322 to removeimpurities from the electrolyte.

The shielding unit 100 may be arranged between the diffusion plate 340and the cathode 332. The shielding unit 100 may include elementssubstantially the same as those of the shielding unit 100 in FIG. 1.Thus, any further illustrations with respect to the shielding unit 100may be omitted herein for brevity. Alternatively, the plating apparatus300 may include the shielding unit 100 a in FIG. 7, the shielding unit100 b in FIG. 9, the shielding unit 100 c in FIG. 11 or the shieldingunit 200 in FIG. 12.

According to example embodiments, the controlling holes of thecontrolling plate may be selectively and partially overlapped with holesof the shielding plate to control the opening ratios of the holes. Thus,the electrolyte may be uniformly distributed to improve a thicknessuniformity of a plated layer. Particularly, the opening ratios of theholes may be controlled by changing a position of the controlling platein accordance with the kind of object being plated so that it may not berequired to exchange the shielding plate for another shielding platewhen a different object is being used.

The foregoing is illustrative of example embodiments and is not to beconstrued as limiting thereof. Although a few example embodiments havebeen described, those skilled in the art will readily appreciate thatmany modifications are possible in the example embodiments withoutmaterially departing from the novel teachings and advantages of thepresent invention. Accordingly, all such modifications are intended tobe included within the scope of the present invention as defined in theclaims. In the claims, means-plus-function clauses are intended to coverthe structures described herein as performing the recited function andnot only structural equivalents but also equivalent structures.Therefore, it is to be understood that the foregoing is illustrative ofvarious example embodiments and is not to be construed as limited to thespecific example embodiments disclosed, and that modifications to thedisclosed example embodiments, as well as other example embodiments, areintended to be included within the scope of the appended claims.

What is claimed is:
 1. A shielding unit for a plating apparatuscomprising: a shielding plate having a plurality of holes configured topermit a passage of an electrolyte therethrough; a controlling plateconfigured to make contact with the shielding plate, the controllingplate having a plurality of controlling holes for controlling an openingratio of the plurality of holes of the shielding plate; and a rotaryactuator configured to rotate the controlling plate to control theopening ratio of the plurality of holes of the shielding plate.
 2. Theshielding unit of claim 1, wherein each of the plurality of holes of theshielding plate has a size substantially the same as a size of each ofthe plurality of controlling holes.
 3. The shielding unit of claim 1,wherein the plurality of holes of the shielding plate are arrangedspaced apart from each other by substantially a same interval.
 4. Theshielding unit of claim 3, wherein the plurality of controlling holesare arranged spaced apart from each other by an interval substantiallythe same as the interval between the plurality of holes of the shieldingplate.
 5. The shielding unit of claim 1, wherein the shielding plate hasa circular shape, and the controlling plate has a rectangular shape. 6.The shielding unit of claim 1, wherein the rotary actuator rotates thecontrolling plate with respect to a center point of the controllingplate.
 7. The shielding unit of claim 1, wherein the shielding platecomprises a first shielding plate and the plurality of holes comprises aplurality of first holes, the shielding unit further comprising a secondshielding plate configured to make contact with the controlling plate,the second shielding plate having a plurality of second holes configuredto permit a passage of an electrolyte therethrough.
 8. The shieldingunit of claim 7, wherein each of the plurality of second holes has asize substantially the same as a size of each of the plurality of firstholes, the plurality of first holes are arranged spaced apart from eachother by substantially the same interval, and the plurality of secondholes are arranged spaced apart from each other by an intervalsubstantially the same as the interval between the plurality of firstholes.
 9. A shielding unit for a plating apparatus comprising: ashielding plate having a plurality of s holes configured to permit apassage of an electrolyte therethrough; a first controlling plateconfigured to make contact with a first region of the shielding plate,the first controlling plate having a plurality of first controllingholes for controlling an opening ratio of the plurality of holes in thefirst region of the shielding plate; and a second controlling plateconfigured to make contact with a second region of the shielding plate,the second controlling plate having a plurality of second controllingholes for controlling an opening ratio of the plurality of s holes inthe second region of the shielding plate.
 10. The shielding unit ofclaim 9, wherein the first region includes at least a central region ofthe shielding plate, the second region includes an edge region of theshielding plate, the first controlling plate comprises a single plateconfigured to make contact with the central region of the shieldingplate, and the second controlling plate comprises a pair of platesarranged at opposing sides of the first controlling plate and isconfigured to make contact with the edge region of the shielding plate.11. The shielding unit of claim 10, further comprising a thirdcontrolling plate arranged between the first controlling plate and thesecond controlling plates and configured to make contact with a thirdregion of the shielding plate, the third controlling plate having aplurality of third controlling holes for controlling an opening ratio ofthe plurality of holes in the third region of the shielding plate. 12.The shielding unit of claim 9, wherein the first region and the secondregion are defined by a radius line of the shielding plate.
 13. Theshielding unit of claim 9, wherein the plurality of holes of theshielding plate, the first controlling holes and the second controllingholes have a substantially same size.
 14. The shielding unit of claim13, wherein the plurality of holes of the shielding plate, the firstcontrolling holes and the second controlling holes are arranged spacedapart from each other by a substantially same interval.
 15. Theshielding unit of claim 9, further comprising a linear actuatorconfigured to move linearly and individually the first controlling plateand the second controlling plate for controlling an opening ratio of theplurality holes of the shielding plate.
 16. A shielding unit for aplating apparatus comprising: a shielding plate having a plurality ofholes configured to permit a passage of an electrolyte therethrough; acontrolling plate positioned adjacent the shielding plate, thecontrolling plate having a plurality of controlling holes configured tocontrol an opening ratio of the plurality of holes of the shieldingplate; and an actuator configured to move the controlling plate tocontrol the opening ratio of the plurality of holes of the shieldingplate.
 17. The shielding unit of claim 16, wherein the shielding unit isconfigured to be positioned in a plating apparatus comprising a platingbath, an anode, a cathode, and a diffusion plate between the anode andthe cathode, the shielding unit being configured to be positionedbetween the diffusion plate and the cathode.
 18. The shielding unit ofclaim 16, wherein the actuator is configured to move the controllingplate from a first position to a second position that changes a degreeto which the plurality of controlling holes overlap the plurality ofholes of the shielding plate to thereby control the opening ratio of theplurality of holes of the shielding plate.
 19. The shielding unit ofclaim 16, wherein the shielding plate comprises a first shielding plateand the plurality of holes comprises a plurality of first holes, theshielding unit further comprising a second shielding plate configured tomake contact with the controlling plate, the second shielding platehaving a plurality of second holes configured to permit a passage of anelectrolyte therethrough.
 20. The shielding unit of claim 19, whereineach of the plurality of second holes has a size substantially the sameas a size of each of the plurality of first holes, the plurality offirst holes are arranged spaced apart from each other by a substantiallysame interval, and the plurality of second holes are arranged spacedapart from each other by an interval substantially the same as theinterval between the plurality of first holes.